NAGIOS: RODERIC FUNCIONANDO

Coefficient of thermal expansion and elastic modulus of thin films

Repositori DSpace/Manakin

IMPORTANT: Aquest repositori està en una versió antiga des del 3/12/2023. La nova instal.lació está en https://roderic.uv.es/

Coefficient of thermal expansion and elastic modulus of thin films

dc.contributor.author	Morais de Lima, Mauricio, Jr.
dc.contributor.author	Lacerda, R.G.
dc.contributor.author	Vilcarromero, J.
dc.contributor.author	Marques, F.C.
dc.date.accessioned	2013-11-26T13:33:05Z
dc.date.available	2013-11-26T13:33:05Z
dc.date.issued	1999
dc.identifier.citation	Morais de Lima, Mauricio, Jr. Lacerda, R.G. Vilcarromero, J. Marques, F.C. 1999 Coefficient of thermal expansion and elastic modulus of thin films Journal of Applied Physics 86 9 4936
dc.identifier.uri	http://hdl.handle.net/10550/31435
dc.description.abstract	The coefficient of thermal expansion (CTE), biaxial modulus, and stress of some amorphous semiconductors(a-Si:H, a-C:H, a-Ge:H, anda-GeC x :H) and metallic (Ag and Al) thin films were studied. The thermal expansion and the biaxial modulus were measured by the thermally induced bending technique. The stress of the metallic films,deposited by thermal evaporation (Ag and Al), is tensile, while that of the amorphousfilmsdeposited by sputtering(a-Si:H, a-Ge:H, anda-GeC x :H) and by glow discharge(a-C:H)is compressive. We observed that the coefficient of thermal expansion of the tetrahedral amorphousthin films prepared in this work, as well as that of the films reported in literature, depend on the network strain. The CTE of tensile films is smaller than that of their corresponding crystalline semiconductors, but it is higher for compressive films. On the other hand, we found out that the elastic biaxial modulus of the amorphous and metallic films is systematically smaller than that of their crystalline counterparts. This behavior stands for other films reported in the literature that were prepared by different techniques and deposition conditions. These differences were attributed to the reduction of the coordination number and to the presence of defects, such as voids and dangling bonds, in amorphousfilms. On the other hand, columnar structure and microcrystallinity account for the reduced elasticity of the metallic films.
dc.relation.ispartof	Journal of Applied Physics, 1999, vol. 86, num. 9, p. 4936
dc.subject	Ciència dels materials
dc.subject	Física
dc.title	Coefficient of thermal expansion and elastic modulus of thin films
dc.type	journal article	es_ES
dc.date.updated	2013-11-26T13:33:05Z
dc.identifier.doi	10.1063/1.371463
dc.identifier.idgrec	037354
dc.rights.accessRights	open access	es_ES
dc.identifier.url	10.1063/1.371463